Original OEM Custom Flexible PCB LCD Display FPC
Flexible circuit boards are widely used in watches, computers, notebook computers, electronic products, cameras, cameras and other fields.
Product Description
| FPC Process Capability List |
| Item |
Content |
Capability |
| 1 |
Product type |
(Single, Double/multilayer) high-density multilayer board, Rigid-Flex board, RF antenna board |
| 2 |
HDI Technology |
2+N+2 |
| 3 |
Layer |
Flex: 1-12L; Rigid+flex: 2-20L |
| 4 |
Finished board size |
Min: 10*10mm; Max: 250*650mm |
| 5 |
Board thickness (Min-Max) |
0.08mm-3.0mm |
| 6 |
Finished product thickness tolerance |
±0.03mm |
| 7 |
Copper foil thickness (Min-Max) |
1/3oz-4oz |
| 8 |
Insulation thickness (Min-Max) |
0.06-3.0mm |
| 9 |
CNC drill hole diameter (Min) |
0.2mm |
| 10 |
Laser drill nozzle aperture (Min) |
0.1mm |
| 11 |
Aperture tolerance (PTH) |
±0.075mm |
| 12 |
Tolerance of drilling hole diameter(NPTH) |
±0.05mm |
| 13 |
PTH Hole Wall Copper Thickness |
≥0.01mm |
| 14 |
Line Width/Spacing (Min) |
0.05mm/0.05mm(1/3oz Copper foil) |
| 15 |
Pad design (Min) |
0.23mm |
| 16 |
Gold finger width/spacing (Min) |
0.05mm/0..05mm |
| 17 |
BGA pad (Min) |
0.23mm |
| 18 |
Minimum center distance between BGA pads |
0.5mm |
| 19 |
Punching hole diameter tolerance |
±0.05mm |
| 20 |
Via hole and via hole spacing |
≥0.1mm |
| 21 |
Minimum distance from line to board edge |
0.1mm (Laser) |
| 22 |
Minimum character |
Character height 0.8mm/Word width0.13mm |
| 23 |
Thermosetting white oil overprint tolerance |
±0.2mm |
| 24 |
Etching tolerance |
±5% |
| 25 |
Surface Finishing |
ENIG, Electric nickel gold, OSP, HAL LF, Immersion Sliver, Immersion Tin |
| 26 |
Punching shape tolerance (laser cutting) |
±0.05mm |
| 27 |
Punching shape tolerance (slow-moving wire steel die) |
±0.05mm |
| 28 |
Punching shape tolerance (fast-moving wire steel die) |
±0.1mm |
| 29 |
Finished board impedance control |
±10% |
| 30 |
Material |
PI, Panasonic, DuPont, Stiffener |
Production Process
Jinhua factory can meet differnt PCB material requirments
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Application
